Thermal Sciences

Applications:

• Cooling of electronics in low atmosphere and space environments

• Automotive under hood

• Cellular infrastructure

• High density memory devices

• Medium and high power processors

• Joule heating effects in CMOS BEOL

• Servers

• LED cooling

• set top boxes

Thermal and stress modeling of electronic packages and interconnects to enable design and evaluation of electronics cooling for improved reliability.

Wafer to Wafer Bonding

Thermal Science Processes:

• Cooling of Electronics
    > Design
    > Evaluation
• Thermal & Stress Modeling
• Reliability Analysis
    > CMOS BEOL Interconnects & Devices
    > Electronic Packages
    > Printed Wiring Boards & Board Level Interconnects
• Materials Science
• 3D Packaging including TSVs
• BEOL interconnect to Package Integration including bumping
• Die-to-wafer, wafer-to-wafer & temporary wafer bonding
• CdTe Solar Cell Fabrication

Thermal Sciences and Modeling for Cooling of Electronics